Transphorm, a global leader in GaN power semiconductors, and Weltrend Semiconductor, the global leader in adapter USB Power Delivery (PD) Controller Integrated Circuits (IC), have announced the release of two new GaN System-in-Packages (SiPs). These SiPs, when combined with Weltrend’s flagship GaN SiP released last year, form the first SiP product family based on Transphorm’s SuperGaN platform.
The new SiPs, named WT7162RHUG24B and WT7162RHUG24C, integrate Weltrend’s high frequency multi-mode Flyback PWM controller with Transphorm’s SuperGaN FETs. These devices can be paired with USB PD or programmable power adapter controllers to deliver a total adapter solution. They feature innovative functionalities such as UHV valley tracking charge mode, adaptive OCP compensation, and adaptive green mode control, enabling customers to design power supplies more efficiently and with fewer components.
“The availability of these new SiPs demonstrates our commitment to serving the AC-to-DC power market with a wider range of devices that support various power levels,” said Wayne Lo, Vice President of Marketing at Weltrend. “The collaboration with Transphorm on the SuperGaN platform provides design simplicity and exceptional performance for power adapters ranging from 30 watts to nearly 200 watts.”
The new SiPs cater to the demand from end-product manufacturers for adapters with reduced bill-of-materials (BOM), fast charging capabilities, and higher power outputs. Additionally, manufacturers are seeking to develop “one-size-fits-all” chargers with multiple ports and connections in a smaller and lighter form factor.
Transphorm’s SuperGaN platform offers several advantages, including robustness, reliability, and increased power density compared to silicon. Teamed up with Weltrend’s SiP designs, these advantages result in a plug-and-play solution that accelerates design processes and reduces form factor size.
The new SiPs from Transphorm and Weltrend Semiconductor are ideal for high-performance, low-profile USB-C power adapters used in mobile/IoT devices such as smartphones, tablets, laptops, headphones, drones, speakers, and cameras.
Both SiPs are currently available for sampling. For more information, please contact [email protected]
About Transphorm
Transphorm, a global leader in GaN technology, designs and manufactures high-performance and high-reliability GaN semiconductors for high voltage power conversion applications. The company’s vertically integrated approach allows for innovation at every development stage, resulting in highly efficient and cost-effective power electronics solutions. Transphorm’s headquarters are located in Goleta, California, with manufacturing operations in Goleta and Aizu, Japan.
About Weltrend Semiconductor Inc.
Weltrend Semiconductor is a leading fabless semiconductor company based in Hsinchu, Taiwan. The company specializes in the planning, design, testing, application development, and distribution of mixed-signal/digital IC products. Weltrend’s products are used across multiple industries, including power supplies, motor controls, and image processing.
Transphorm and Weltrend Semiconductor have unveiled two new GaN System-in-Packages (SiPs) that are part of the first SiP product family based on Transphorm’s SuperGaN platform. The SiPs, named WT7162RHUG24B and WT7162RHUG24C, integrate Weltrend’s high frequency multi-mode Flyback PWM controller with Transphorm’s SuperGaN FETs. These devices can be paired with USB PD or programmable power adapter controllers to deliver a total adapter solution.
One of the advantages of these new SiPs is their ability to reduce the bill-of-materials (BOM) for end-product manufacturers, while also providing fast charging capabilities and higher power outputs. Manufacturers are also looking to develop “one-size-fits-all” chargers with multiple ports and connections in a smaller and lighter form factor, and these SiPs cater to that demand.
Transphorm’s SuperGaN platform offers several advantages, including robustness, reliability, and increased power density compared to silicon. When combined with Weltrend’s SiP designs, these advantages result in a plug-and-play solution that accelerates design processes and reduces the form factor size.
These new SiPs are ideal for high-performance, low-profile USB-C power adapters used in mobile/IoT devices such as smartphones, tablets, laptops, headphones, drones, speakers, and cameras. They offer customers the ability to design power supplies more efficiently and with fewer components, thanks to innovative functionalities such as UHV valley tracking charge mode, adaptive OCP compensation, and adaptive green mode control.
The market for GaN power semiconductors is expected to grow in the coming years. According to a report by Market Research Future, the global GaN power semiconductor market is projected to reach a value of USD 1.9 billion by 2023, with a compound annual growth rate (CAGR) of 29.2% during the forecast period.
However, despite the potential growth, there are challenges and controversies associated with GaN power semiconductors. One of the challenges is the high cost of GaN technology compared to traditional silicon-based technologies. This cost can be a barrier to widespread adoption, especially in price-sensitive markets.
Another challenge is the limited availability of GaN manufacturing facilities. Currently, there are only a few manufacturers with the capability to produce GaN power semiconductors at scale. This limited capacity can lead to supply chain constraints and increased lead times for customers.
There is also a controversy surrounding the environmental impact of GaN power semiconductors. While GaN technology offers higher efficiency and increased power density, the production of GaN materials involves the use of toxic chemicals. Proper handling and disposal of these chemicals are crucial to mitigate any potential environmental risks.
Overall, the release of these new GaN SiPs by Transphorm and Weltrend Semiconductor addresses the market demand for reduced BOM, fast charging capabilities, and higher power outputs in power adapters for mobile/IoT devices. The advantages of Transphorm’s SuperGaN platform, combined with Weltrend’s SiP designs, offer customers a simplified and efficient solution. However, challenges related to cost, limited manufacturing capacity, and environmental concerns remain.
For more information about Transphorm, please visit their website.
For more information about Weltrend Semiconductor, please visit their website.