StratEdge Corporation, a leading provider of high-frequency and high-power semiconductor packages, is set to reveal its latest packaging technology for high-frequency applications at upcoming industry conferences in May. These events will be held in California and Arizona, emphasizing StratEdge’s dedication to producing packages that optimize the performance of demanding GaAs and GaN devices in extreme conditions.
One of the conferences where StratEdge will be exhibiting is the Components for Military & Space Electronics Conference & Exhibition (CMSE) in Los Angeles, CA from May 1-2. Attendees can visit StratEdge at Booth B20 to learn more about their offerings.
StratEdge will also showcase their power amplifier packages at the Space Tech Expo in Long Beach, CA, taking place from May 13-15. These packages play a vital role in transmitting signals from commercial and government satellites, as well as other long-range communications equipment. Interested individuals can find StratEdge at Booth 5027.
Furthermore, StratEdge will participate in CS Mantech in Tucson, AZ from May 20-22, where they will be located at Booth 199. The company will emphasize their latest high-reliability package families at this event.
StratEdge has gained a reputation over the past two decades for providing packages known for their low-loss performance, heat dissipation capabilities, and high reliability. With the constant push for increased power and higher frequencies in semiconductor chips, these packages have become more critical than ever. By attending these shows, StratEdge aims to collaborate with engineers in developing packages that enable optimal chip performance.
To learn more about the company and its expanded production facilities, interested individuals can take a virtual tour at https://youtu.be/ewJuORN5vyQ or reach out to [email protected].
Photo: [Link to the image of StratEdge packages in satellites]
About StratEdge:
StratEdge Corporation specializes in the design, manufacturing, and assembly of high-frequency and high-power semiconductor packages operating from DC to 63+ GHz. With a focus on demanding GaAs and GaN devices, StratEdge offers a range of post-fired ceramic and lower-cost molded ceramic packages. Their packages cater to various markets, including telecom, satellite, defense, automotive, and clean energy. All StratEdge packages are lead-free, with most meeting RoHS and WEEE standards. The company’s facility in Santee, California, is ITAR registered and ISO 9001:2015 certified.
For media inquiries, please contact:
Casey Krawiec
StratEdge Corporation
9424 Abraham Way, Santee, CA 92071
Email: [email protected]
Phone: +1.858.569.5000
Tricia McGough
TW Marketing (agency)
Email: [email protected]
Phone: +1.254.383.9700
New Packaging Technology for High-Frequency Applications Showcased at Industry Conferences
StratEdge Corporation, a leading provider of high-frequency and high-power semiconductor packages, is set to reveal its latest packaging technology for high-frequency applications at upcoming industry conferences in May. These events will be held in California and Arizona, emphasizing StratEdge’s dedication to producing packages that optimize the performance of demanding GaAs and GaN devices in extreme conditions.
One of the conferences where StratEdge will be exhibiting is the Components for Military & Space Electronics Conference & Exhibition (CMSE) in Los Angeles, CA from May 1-2. This conference focuses on the latest advancements in electronic components for military and space applications, which require high-reliability and high-performance packages. StratEdge will be at Booth B20, showcasing its packaging technology designed specifically for these demanding environments.
StratEdge will also showcase its power amplifier packages at the Space Tech Expo in Long Beach, CA, taking place from May 13-15. These packages play a vital role in transmitting signals from commercial and government satellites, as well as other long-range communications equipment. The demand for higher frequencies and increased power in these applications drives the need for advanced packaging solutions. Interested individuals can find StratEdge at Booth 5027 to learn more about their power amplifier packages.
Furthermore, StratEdge will participate in CS Mantech in Tucson, AZ from May 20-22. This conference focuses on compound semiconductor manufacturing technology and attracts industry professionals involved in RF and microwave technology. At Booth 199, StratEdge will highlight their latest high-reliability package families, which are crucial for applications in the aerospace, defense, and telecommunications sectors.
Advantages of StratEdge’s packaging technology include:
1. Low-loss performance: StratEdge packages are known for their low-loss characteristics, ensuring minimal signal degradation and maximizing overall system performance.
2. Heat dissipation capabilities: The packaging technology is designed to efficiently dissipate heat generated by high-frequency semiconductor devices, preventing overheating and ensuring reliable operation.
3. High reliability: StratEdge’s packages are built to withstand extreme conditions, making them reliable for applications that require long-term performance and durability.
However, there are also challenges and controversies associated with high-frequency packaging technologies, including:
1. Cost: Advanced packaging technologies often come at a higher cost compared to traditional packaging options. This cost can be a barrier for some companies and industries, limiting widespread adoption.
2. Design complexity: High-frequency packaging requires sophisticated design considerations to minimize signal losses and interference. Designing and optimizing these packages can be challenging and time-consuming.
3. Integration with existing systems: When introducing new packaging technologies, compatibility and integration with existing systems can be a challenge. Ensuring seamless integration and interoperability is crucial to avoid disruption and achieve maximum benefits.
In terms of market trends, the demand for high-frequency packages is expected to grow significantly in various industries, including telecommunications, satellite communications, defense, and automotive. With the rollout of 5G networks and the increasing need for faster and more reliable communication systems, the demand for high-frequency packages is projected to increase. The adoption of gallium nitride (GaN) and gallium arsenide (GaAs) devices in these industries will further drive the demand for optimized packaging solutions.
Forecast for the market suggests continued growth in the high-frequency packaging sector. According to a report by MarketsandMarkets, the global market for high-frequency packaging is projected to reach $16.14 billion by 2022, growing at a CAGR of 8.93% between 2017 and 2022. This growth is fueled by the increasing demand for high-performance and reliable electronic systems in various industries.
In conclusion, StratEdge’s latest packaging technology for high-frequency applications showcased at the industry conferences in May demonstrates their commitment to meeting the demands of the market. The advantages of their packaging technology include low-loss performance, heat dissipation capabilities, and high reliability. However, challenges such as cost and design complexity exist. The market is expected to grow with the increasing demand for high-frequency packages in sectors such as telecommunications, satellite communications, defense, and automotive.
To learn more about the company and its expanded production facilities, interested individuals can take a virtual tour at StratEdge’s virtual tour or reach out to [email protected].
Photo: [Link to the image of StratEdge packages in satellites]
About StratEdge:
StratEdge Corporation specializes in the design, manufacturing, and assembly of high-frequency and high-power semiconductor packages operating from DC to 63+ GHz. With a focus on demanding GaAs and GaN devices, StratEdge offers a range of post-fired ceramic and lower-cost molded ceramic packages. Their packages cater to various markets, including telecom, satellite, defense, automotive, and clean energy. All StratEdge packages are lead-free, with most meeting RoHS and WEEE standards. The company’s facility in Santee, California, is ITAR registered and ISO 9001:2015 certified.
For media inquiries, please contact:
Casey Krawiec
StratEdge Corporation
9424 Abraham Way, Santee, CA 92071
Email: [email protected]
Phone: +1.858.569.5000
Tricia McGough
TW Marketing (agency)
Email: [email protected]
Phone: +1.254.383.9700
Source: PR Newswire
Forecast source: MarketsandMarkets